A great news from PowerLink!
Our new product, PowerCubic will be soon launched in HKTDC Hong Kong Electronics Fair (Autumn Edition), which will be held from October 13 to 16, 2013, and the fair venue is Hong Kong Convention and Exhibition Centre (visit our booth: No. 1A-D20, Hall of Fame). For visitor information, please check out HERE.
PowerCubic is another addition to our modular sockets product range, let’s view the product video above to learn more about its features.